The USB 3.0 Promoter Group (usb)
In 2009 the USB 3.0 is the next-generation high-speed standard. The USB 3.0 Promoter Group will offer the speed of USB 3.0 over 10 times faster than today's technology. It is about 5 GB/s and will be the future solution for the high-speed bandwidth need in the PC, consumer and mobile segments. And will be optimized for lower power and improved protocol efficiency.
Intel Corporation, Microsoft Corporation, NEC Corporation, NXP Semiconductors, Texas Instruments Incorporated and HP are behind the USB 3.0 Promoter Group. The USB 3.0 specification will be unveiled to the industry on November 17 the SuperSpeed USB (USB 3.0) Developers Conference, hosted by the USB Implementers Forum in San Jose, California.
The USB 3.0 SuperSpeed (usb)
Intel had been released the Extensible Host Controller Interface (xHCI) specification in support of the USB 3.0 architecture. xHDI specification provides a standardized method for USB 3.0 hardware to communicate with USB 3.0-specific software. Under royalty free licensing terms, all USB 3.0 Promoter Group and contributor companies that sign an xHCI contributor agreement will get the updated specification.
The USB 3.0 Promoter Group public Web site has about 791 companies registered as USB Implementers member. To obtain access to the current draft of the specification the USB Implementers member had to sign a USB 3.0 contributor agreement within the site.
